SPUTTERING CATHODE, SPUTTERING APPARATUS PROVIDED WITH SPUTTERING CATHODE, FILM-FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sputtering cathode in which flexibility of adjustment of a distance between a target and a magnet unit is increased. SOLUTION: A sputtering cathode includes the plurality of magnet units 7 arranged at positions opposite to the rear surface of the target 1 and a distance adjusting mechanism for separately adjusting a distance between the target 1 and the magnet unit 7 for each magnet unit 7. In addition, the sputtering cathode includes a reciprocating mechanism for reciprocating the plurality of magnet units 7 in parallel to the rear surface of the target. The plurality of magnet units 7, the distance adjusting mechanisms and the reciprocating mechanism may be housed in a magnet chamber that can be evacuated. COPYRIGHT: (C)2010,JPO&INPIT