| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic circuit component with a function of applying an adhesive for temporarily fitting the electronic circuit component to a circuit board. <P>SOLUTION: A mounting module 13 (electronic circuit component mounting machine) which receives electronic circuit components supplied from a plurality of feeders 26 of a component supply device 24 by a mounting head, and mounts them on a printed circuit board conveyed and held by a front or rear conveyor sections 260 or 262 of a circuit board conveying device 34 is provided with a head moving device capable of selectively fitting the mounting head which holds a suction nozzle and a coating head for applying an adhesive, and a plurality of fitting units 610. Each of the fitting units 610 is detachably fitted with a nozzle stocker for replacing the suction nozzle with the mounting head and a test application device for performing test application of the adhesive by the coating head. <P>COPYRIGHT: (C)2010,JPO&INPIT |
