发明名称 PACKAGE FOR HOUSING LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for housing a light-emitting element, capable of improving the reliability between the contact portions of an insulation substrate and a heat sink body, and efficiently radiating heat generated from the light-emitting element. <P>SOLUTION: The package 10 for housing a light-emitting element has an insulation substrate 11, a reflector 12 and a heat sink body 13. The package 10 includes a through-hole 15 provided on the center portion of an insulation substrate 11 on the bottom surface of a cavity portion 16 formed of the upper surface of the insulation substrate 11 and an inclined inner circumferential wall surface of the reflector 12 and used to house a light-emitting element 14, a metallic screw body 20 provided upright to the lower surface of the insulation substrate 11 by being engaged and bonded to the wall surface, allowing the tip side end surface of one side to be the same plane or protruding parallel surface to the upper surface of the insulation substrate 11 and providing male screw 21 on the other tip side from the lower surface of the insulation substrate 11, and a heat sink body 13 screwed with the male screw 21 via the female screw hole 23 and radiate heat from the light-emitting element 14 placed on the end surface of the screw body 20. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010034262(A) 申请公布日期 2010.02.12
申请号 JP20080194515 申请日期 2008.07.29
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 FUKUNAGA NORIKAZU
分类号 H01L33/48 主分类号 H01L33/48
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