| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board the deformation of which can be reduced while suppressing an increase in thickness. <P>SOLUTION: The multilayer printed wiring board 1 includes: an insulating resin layer 11; an electronic component 13 bonded onto the insulating resin layer 11; spacers 14 bonded onto the insulating resin layer 11; reinforcing members 16; and an interlayer adhesion layer 12 provided in a gap around the electronic component 13 and reinforcing members 16 and containing a resin; and an insulating resin layer 21 provided on the adhesion layer. The reinforcing members 16 are made of a shape memory alloy and enclose the electronic component in plan view. The reinforcing members 16 are embedded in the spacers 14. <P>COPYRIGHT: (C)2010,JPO&INPIT |
