| 摘要 |
THERE IS DISCLOSED A METHOD OF MAKING AN ELECTRONIC PACKAGE (10) BY FORMING A METAL BASE (50) ON WHICH TO BUILD THE COMPONENTS OF AN ELECTRONIC PACKAGE ; APPLYING A MASK LAYER (60) ON THE BASE TO AN AREA THAT IS NOT TO BE OCCUPIED BY INTERCONNECTION PADS (200) OR DIE ATTACHMENT PADS (201) OF THE PACKAGE; PLATING LAYERS OF METAL ON THE UN-MASKED AREAS OF THE BASE TO FORM THE INTERCONNECTION AND DIE ATTACHMENT PADS (200, 201); REMOVING THE MASK LAYER; MOUNTING A SEMICONDUCTOR DIE (302) TO AT LEAST ONE DIE ATTACHMENT PAD (201) ; ELECTRICALLY CONNECTING THE SEMICONDUCTOR DIE (302) TO ONE OR MORE INTERCONNECTION PADS (200); EMBEDDING THE COMPONENTS ON THE BASE IN AN ENCAPSULATION MATERIAL (300) TO FORM A PACKAGE; REMOVING THE METAL BASE (50) TO LEAVE A PACKAGE PANEL; AND CUTTING THE PANEL INTO DISCRETE PACKAGE UNITS. |
