| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently shorten a cleaning time for a wafer by cleaning the wafer without fixing it and thus omitting an operation for re-gripping the wafer. SOLUTION: The cleaning method for the wafer includes jetting pure water over the entire surface of a disk-like base 12, having an external diameter smaller than the diameter of the wafer 11 and installed in a horizontal direction, to uniform height from the base 12; floating the disk-like wafer, placed concentrically with the base, over the base with the jetted pure water; and cleaning the lower surface of the wafer with the pure water jetted from the base. A cleaning device 10 includes the disk-like base 12 which has the external diameter smaller than the diameter of the wafer, has a plurality of equal-diameter jet holes 13a formed over the entire surface, and also has a hollow portion 12a communicating with the jet holes, formed in the base, and is installed in the horizontal direction, and a pure water supply means 21 of jetting the pure water from the plurality of jet holes through the hollow portion to the uniform height over the entire surface of the base. COPYRIGHT: (C)2010,JPO&INPIT |
