| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the occurrence of a defect such as a crack and performing a stable operation. SOLUTION: The semiconductor device A1 has a rectangular semiconductor chip 1, a tabular lead 2 mounted with the semiconductor chip 1 on its surface and a cushioning member 3 bonding the semiconductor chip 1 and the lead 2. In the semiconductor device, a plurality of projections 21 interposing the cushioning member 3 among the projections and the semiconductor chip 1 are formed on the surface of the lead 2. In the semiconductor device, the plurality of projections 21 are arranged so as not to be superposed at four corners of the semiconductor chip 1 from a view of the thickness direction of the lead 2. COPYRIGHT: (C)2010,JPO&INPIT |
