| 发明名称 |
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE |
| 摘要 |
Disclosed is an adhesive composition containing (A) a thermoplastic resin having a Tg of not more than 100°C and (B) a thermosetting component. The thermosetting component (B) contains (B1) a compound having an allyl group and (B2) a compound having a maleimide group. |
| 申请公布号 |
WO2010016305(A1) |
申请公布日期 |
2010.02.11 |
| 申请号 |
WO2009JP58502 |
申请日期 |
2009.04.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;MASUKO TAKASHI;KATOGI SHIGEKI |
发明人 |
MASUKO TAKASHI;KATOGI SHIGEKI |
| 分类号 |
C09J4/00;C09J7/00;C09J7/02;C09J11/04;C09J163/00;C09J179/08;C09J201/00;H01L21/02;H01L21/301;H01L21/52 |
主分类号 |
C09J4/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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