APPARATUS FOR MOLDING AN ELECTRONIC DEVICE

摘要

PURPOSE: An apparatus for molding an electronic device is provided to reduce the transfer distance of a tray and an electronic component by arranging a metallic pattern, a resin feed supply unit, a pickup unit around the loader. CONSTITUTION: Two molds(102) are arranged to a first direction and molds electronic components. A loader(152) is arranged between molds. The loader loads electronic components in which the resin powder to mold electronic components. A pickup unit(168) is arranged at the one side of the loader in a second direction vertical to a first direction and transfers electronic components to the loader. A rein feeder(140) is arranged in the other side of the loader facing to the pickup unit. The rein feeder transfers trays in which the resin powder is loaded to the loader.