发明名称 Optical coupler package
摘要 A method is disclosed. The method includes forming a substrate with a leadframe and a molding compound. The molding compound fills internal spaces in the leadframe and forms a dam structure. An optical emitter and an optical receiver are placed on the substrate. An optically transmissive medium is formed between the optical emitter and optical receiver.
申请公布号 US7659531(B2) 申请公布日期 2010.02.09
申请号 US20070735257 申请日期 2007.04.13
申请人 FAIRCHILD SEMICONDUCTOR CORPORATION 发明人 CHOI YOON HWA;KWON YONG SUK;QUINONES MARIA CLEMENS Y.
分类号 G02B27/00 主分类号 G02B27/00
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