| 摘要 |
A light emitting diode (LED) chip package is provided. The LED chip package comprises a carrier, a first LED chip, a second LED chip and an encapsulant. The first LED chip is disposed on and electrically connected to the carrier, wherein the first LED chip is adapted for emitting a first light. The second LED chip is disposed on and electrically connected to the carrier, wherein the second LED chip is adapted for emitting a second light. The encapsulant has a doped phosphor, and encapsulates the first LED chip and the second LED chip, wherein the first light is adapted for exciting the doped phosphor to emit a third light.
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