发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board excelling in a heat radiation characteristic. SOLUTION: This printed wiring board includes an insulation base material, and a conductor circuit wired thereon. In the printed wiring board, the conductor circuit is formed of dense electroplated copper containing carbon nanotubes. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010027916(A) 申请公布日期 2010.02.04
申请号 JP20080188839 申请日期 2008.07.22
申请人 MEIKO:KK;SHINSHU UNIV 发明人 EIKI SHUNSUKE;ARAI SUSUMU
分类号 H05K1/09;H05K1/11 主分类号 H05K1/09
代理机构 代理人
主权项
地址
您可能感兴趣的专利