PHYSICAL VAPOR DEPOSITION APPARATUS AND PHYSICAL VAPOR DEPOSITION METHOD

摘要

This invention provides a physical vapor deposition apparatus and a physical vapor deposition method, which can form a film of a material which, even when heated, for example, by plasma or arc discharge, cannot be microparticulated without difficulties. The physical vapor deposition apparatus comprises an evaporation chamber (10) comprising, in its interior, an evaporation source material (15) and a heating part (16) for heating the evaporation source material (15), a powder supply source (20) containing a powder therein, and a film forming chamber (30). The evaporation source material (15) is heated by the heating part (16) to produce fine particles (nanoparticles), and the fine particles and the powder are jetted through a supersonic nozzle (35), are put on a supersonic gas stream, and are deposited by physical vapor deposition on a film forming object substrate (33).