| 摘要 |
An optical semiconductor apparatus composed of a cap and a base, includes: a metal package including a plurality of openings penetrating through the base from outside to inside, a lead with its end portion protruding to the inside of the base and an insulator covering a side surface of the lead being inserted into each of the openings, and the lead being insulated from the base; an insulating film with its backside bonded to the inside of the base; and a semiconductor component placed on the base or on the insulating film. The insulating film covers the opening up to the vicinity of the side surface of the lead.
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