SEMICONDUCTOR MODULE AND PORTABLE APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE

摘要

A semiconductor element (40) mounted on an insulating resin layer (30) formed on a wiring layer (20) is sealed by a sealing resin (50).  On the wiring layer (20), a protruding electrode (22) protruding to the side of the semiconductor element (40) and a protruding section (80) are integrally formed with the wiring layer, respectively.  The protruding electrode (22) is electrically connected to an element electrode (42) of the semiconductor element (40) by penetrating the insulating resin layer (30).  The protruding section (80) is arranged to surround the semiconductor element (40) along the four sides of the semiconductor element (40), and is embedded in the sealing resin (50) up to a position above a section where the protruding electrode (22) and the element electrode (42) are bonded.