| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce cost required for manufacturing an IC card. <P>SOLUTION: An inlet 101 is sealed while sandwiched between an outer sheet 301 and an outer sheet 302. The outer sheet 301 includes a recessed part having a size and thickness into which a reinforcement plate 111 and an adhesive layer 112 mounted on the inlet 101 are inserted. Similarly, the outer sheet 302 includes a recessed part having a size and thickness into which an IC chip 116, etc., mounted on the inlet 101 are inserted. The outer sheet 301 and the outer sheet 302 are made of thermoplastic materials to seal the inlet 101 when they are heated. <P>COPYRIGHT: (C)2010,JPO&INPIT |
