发明名称 COMPACT MULTILEVEL ELECTRICAL INTEGRATION OF MICROSYSTEMS
摘要 A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section-the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.
申请公布号 US2010029148(A1) 申请公布日期 2010.02.04
申请号 US20090415177 申请日期 2009.03.31
申请人 PERLIN GAYATRI EADARA;CASEY BRENDAN E;GULARI MAYURACHAT NING;WISE KENSALL D 发明人 PERLIN GAYATRI EADARA;CASEY BRENDAN E.;GULARI MAYURACHAT NING;WISE KENSALL D.
分类号 H01R13/02 主分类号 H01R13/02
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