发明名称 |
COMPACT MULTILEVEL ELECTRICAL INTEGRATION OF MICROSYSTEMS |
摘要 |
A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section-the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.
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申请公布号 |
US2010029148(A1) |
申请公布日期 |
2010.02.04 |
申请号 |
US20090415177 |
申请日期 |
2009.03.31 |
申请人 |
PERLIN GAYATRI EADARA;CASEY BRENDAN E;GULARI MAYURACHAT NING;WISE KENSALL D |
发明人 |
PERLIN GAYATRI EADARA;CASEY BRENDAN E.;GULARI MAYURACHAT NING;WISE KENSALL D. |
分类号 |
H01R13/02 |
主分类号 |
H01R13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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