Verfahren zur Verpackung einer matrixartigen modularisierten LED-Struktur

摘要

An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate 2 and an upper substrate 1 fixed on the lower substrate 2. A material with high heat conductivity is selected as the material of the upper substrate 1. The upper substrate 1 is formed with multiple arrayed dents 11 and through holes 12 on the bottom 111 of each dent 11. A material with high heat conductivity is selected as the material of the lower substrate 2. The surface of the lower substrate 2 is formed with a predetermined circuit layout card 21. The bottom 111 face of the upper substrate 1 is placed on the upper face of the lower substrate 2 with the through holes 12 of the dents 11 respectively corresponding to the contact electrodes 212 of the circuit layout card 21 of the lower substrate 2. Multiple light-emitting diode crystallites 4 are respectively fixed on the bottoms 111 of the dents 11. Via the through holes 12, the electrodes of the light-emitting diode crystallites 4 are electrically connected with the contact electrodes 212. Then the dents 11 of the upper substrate 1 are sealed to prevent the light-emitting diode crystallites 4 from being oxidized.