发明名称 METHOD OF MOLDING FIBER SUBSTRATE AND MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of molding a fiber substrate suppressing burring upon compression molding and cutting of the fiber substrate, and also to provide a molding device for molding the fiber substrate. SOLUTION: The method of molding the fiber substrate comprises: a compression molding process of compression molding a heated fiber substrate 11 while swelling at least a part of outer marginal part of the fiber substrate 11 from molding molds 12, 13; and a cutting process of cutting a part 11c swollen from the molding molds 12, 13 of the fiber substrate 11 while clamping the molding molds 12, 13 after the compression molding process. The cutting is not performed upon the compression molding but is performed after the compression molding and, therefore, the burring is suppressed. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010023466(A) 申请公布日期 2010.02.04
申请号 JP20080191202 申请日期 2008.07.24
申请人 TOYOTA BOSHOKU CORP 发明人 KAMIYA HIDEO;NAGATANI TAMOTSU;MUKAI HIROAKI
分类号 B29C43/38;B29C43/32;B29K105/06 主分类号 B29C43/38
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