| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallized polyimide film suitable for flexible printed wiring board, especially for fine pitched flexible printed wiring board, and excellent in dimensional stability, and also to provide a method for manufacturing the same. SOLUTION: The method for manufacturing the metallized polyimide film includes steps of: (1) forming a base metal layer by a vapor depositing method or a sputtering method on a surface of a polyimide film; and (2) forming a copper layer on the obtained base metal layer of the polyimide film by an electroplating method, electroless plating method, or method combined the both. An oxygen permeation rate of the polyimide film is 300-600 cm<SP>3</SP>/(m<SP>2</SP>×24 h×atm). COPYRIGHT: (C)2010,JPO&INPIT |
