发明名称 Apparatus and method for sputtering target debris reduction
摘要 Certain example embodiments relate to techniques for reducing the amount of debris being formed on the surface of planar sputtering targets. More particularly, a coating may be applied to the sputtering material in areas where sputtering substantially does not occur (typically inside and outside of a racetrack) in certain example embodiments. The coating optionally may be cured. In certain example embodiments, the coating may be include inorganic materials or materials that resist decomposition in a severely oxidizing environment, and/or are electrically non-conductive materials. For example, the coating may be a cured-form sol-gel comprising, for example, silicon oxide, titanium oxide, and/or the like. The coating substantially encapsulates the target material where sputtering substantially does not occur, thus reducing the amount of debris that is created during sputter coating.
申请公布号 US2010025229(A1) 申请公布日期 2010.02.04
申请号 US20080219944 申请日期 2008.07.30
申请人 GUARDIAN INDUSTRIES CORP. 发明人 MILLER GREG
分类号 C23C14/35 主分类号 C23C14/35
代理机构 代理人
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