发明名称 METHOD OF MANUFACTURING CERAMIC MULTILAYERED WIRING BOARD, AND CERAMIC MULTILAYERED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic multilayered wiring board that achieves high size precision of each layer of the ceramic multilayered wiring board, and lowers facility costs for the ceramic multilayered wiring board regardless of the number of laminated layers of the ceramic multilayered wiring board, and the ceramic multilayered wiring board. SOLUTION: In the method of manufacturing the ceramic multilayered wiring board 1, four layers of ceramic green sheets 21, 22, 23, and 24 are formed by dividing one mother sheet 2 after forming all of wiring patterns of the respective layers on the mother sheet 2. Then those are laminated and baked to obtain the ceramic multilayered wiring board. Consequently, manufacturing periods of the ceramic green sheets 21, 22, 23, and 24 of all the layers are coincident with one anther, and volatilization amounts and remaining amounts of organic solvents thereof become constant. When one kind of mother sheet 2 is used, less jigs and tools may be required. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010027665(A) 申请公布日期 2010.02.04
申请号 JP20080183827 申请日期 2008.07.15
申请人 ALPS ELECTRIC CO LTD 发明人 KOSAKA KUNIO
分类号 H05K3/46;H01L23/12;H05K3/00 主分类号 H05K3/46
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