发明名称 Manufacturing method of printed circuit board using an ink jet
摘要 A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.
申请公布号 US7653990(B2) 申请公布日期 2010.02.02
申请号 US20070785096 申请日期 2007.04.13
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE CHOON-KEUN;HONG MYEONG-HO;RA SENUG-HYUN
分类号 H05K3/10;H05K3/02 主分类号 H05K3/10
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