| 摘要 |
A thermally conductive polymer composition having enhanced mechanical properties is provided. The polymer composition consists of a base polymer matrix loaded with fillers that results in a thermal conductivity that is greater than 1.5 W/m° K and a tensile modulus within an acceptable range making the composition suitable for structural plastic applications, such as between 1,700 to 12,000 Mpa and more preferably between approximately 2,700 to 10,000 Mpa and even more preferably in the range of between approximately 4,000 to 9,000 Mpa. In addition to a tensile modulus within the identified range the composition also includes an elongation to break value that is at least above 1.0% and more preferably in the range of about 1.2% to 10%. |
