APPARATUS FOR MOLDING A ELECTRONIC DEVICE

摘要

PURPOSE: An apparatus for molding an electronic device is provided to reduce manufacturing costs by clamping a release film and making the structure of the clamping member simple. CONSTITUTION: A lower die(114) comprises a top side which is coated with a release film(30) while being arranged on a lower support(112). A cavity member(116) has inner sides which limit the cavity with the top side of the lower die while protecting the lower die. A lower tube(118) is supported by the lower support while surrounding the cavity member. A lower clamp(154) is arranged on a lower tube. An upper clamp(152) is movable toward the lower clamp to clamp the release film.