APPARATUS FOR TREATING ELECTROLESS PLATING METHOD USING MAGNETIC FIELD OF TREATING ELECTROLESS PLATING USING MAGNETIC FIELD AND APPARATUS FOR TREATING ELECTROLESS PLATING

摘要

PURPOSE: An electroless plating apparatus and method using a magnetic field are provided to form a uniform plating layer at doubled speed by reducing the activation energy of reducing agent included in plating solution. CONSTITUTION: An electroless plating apparatus using a magnetic field comprises a plating bath(110) and a magnetic field generating part(120). The plating bath stores metal salt aqueous solution for creating metallic ion. A wafer(W) to be plated is dipped in the plating bath. The magnetic field generating part creates a magnetic field for improving accessibility of metallic ion to the surface of the wafer.