SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to suppress a temperature rise of an electronic component by forming a heat sink on the rear of a polyimide substrate or substrate of an insulation protective layer. CONSTITUTION: A wiring pattern(14) is formed on a surface of a polyimide substrate(12). An electronic component(20) is bonded with an internal lead(16) of a wiring pattern. A sealing resin(32) is interposed between the electronic component and the internal lead. An insulation protective layer(22) is coated on the surface of the wiring pattern except for an external lead(18) and the internal lead. The heat sink is formed on the surface of the insulation protective layer. The heat sink is made of metal. One of the thickness and size of the heat sink, and the kind of metals are adjusted to reduce the surface temperature of the electronic component.