GAP-FILL COMPOSITION AND METHOD OF FORMING INTERCONNECTION LINE FOR SEMICONDUCTOR DEVICE,申请号KR20070138040-传众专利搜索

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发明名称	GAP-FILL COMPOSITION AND METHOD OF FORMING INTERCONNECTION LINE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	KR100938445(B1)	申请公布日期	2010.01.25
申请号	KR20070138040	申请日期	2007.12.26
申请人		发明人
分类号	C08G61/10;C08G61/00;C08L65/00;H01L21/31	主分类号	C08G61/10
代理机构		代理人
主权项
地址

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