发明名称 PARTICLE REMOVING MEMBER OF SUBSTRATE PROCESSING EQUIPMENT
摘要 <p>PURPOSE: A particle removing member of substrate processing equipment is provided to eliminate conveniently attached foreign substance. CONSTITUTION: In the release-treated polyester film releasing mold, the adhesive layer is formed. The ultraviolet hardening-type adhesive layer is formed in one side of the polyester film. The polyester film releasing mold is laminated in the surface of the ultraviolet hardening-type adhesive layer as the protection film. In the other side of the polyester film, the adhesive layer is laminated. Therefore, the lamination sheet of 5 layered structure is formed. The damping layer is formed.</p>
申请公布号 KR20100007824(A) 申请公布日期 2010.01.22
申请号 KR20090118366 申请日期 2009.12.02
申请人 NITTO DENKO CORPORATION 发明人 HASHIMOTO KOICHI;OTA YOSHIO
分类号 B08B1/02;H01L21/02;B05D1/00;B08B7/00;B32B9/04;H01L21/304;H01L21/677;H01L21/68;H05K3/26 主分类号 B08B1/02
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