NON-CONTACT WAFER TRANSFERRING DEVICE

摘要

PURPOSE: A non-contact wafer transferring device is provided to prevent the damage of wafer by non contact method. CONSTITUTION: The transfer unit includes the wafer facing portion(2) and cover portion(3). The driving unit transfers the transport unit. The air supply unit supplies the air to the transport unit. The first hole and the second hole are formed in the wafer portion. The air flow path interlinks the first hole and space portion. The third hole is formed in the lid part. The third hole is the same form as the second hole. The air supplying part supplies the air to the space part. The air is inhaled through the air passenger to the first hole. The air occurs the circular stream within the first hole.