| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition for liftoff which forms a microgroove having a larger degree of bite than a conventional one and is suitable for use in the formation of a metal wiring pattern by a liftoff process. <P>SOLUTION: The positive resist composition for liftoff contains: an alkali-soluble resin (A); a photosensitive agent (B); and a sensitizer (C), wherein the content of the component (C) is 40-80 mass% relative to the amount of the component (A), and the component (C) is represented by a predetermined chemical formula. <P>COPYRIGHT: (C)2010,JPO&INPIT |
