SUBSTRATE FOR METAL PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SUBSTRATE

摘要

Disclosed are a substrate for a metal printed circuit board and a method for manufacturing the substrate. The method for manufacturing the substrate for a metal printed circuit board of the present invention includes a step of forming an insulating layer on a metal substrate through a sputtering method for physical vapor deposition, a step of depositing a first thin film, formed of conductive metal and having compressive residual stress, on the insulating layer through a sputtering method, a step of depositing a second thin film, formed of conductive metal and having tensile residual stress, on the first thin film through a sputtering method, and a step of depositing a thick electrical conductive layer with total residual stress controlled within a preset range by repeating the steps of depositing the first thin film and the second thin film.