| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a wire from being damaged caused by stress as much as possible, the stress being generated in the wire owing to thermal expansion/contraction differences between a contact auxiliary film and a mold resin. <P>SOLUTION: A bonding wire 40 has a loop shape which is convex upward toward one surface 21 of a circuit board 20, and the contact auxiliary film 60 interposed between the circuit board 20 and mold resin 50 is provided on the one surface 21 of the circuit board 20; and the contact auxiliary film 60 in a fillet shape spreading from the side of the wire 40 to the side of the circuit board 20 is interposed between a part of the wire 40 which extends from a connection portion 41 on a pad side to a peak portion 42 and the one surface 21 of the circuit board 20 to fill the part therebetween in contact with the wire 40 and circuit board 20, and the contact auxiliary film 60 positioned below the wire 40 is ≤0.2 mm thick and has a softening point of ≥150°C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
