发明名称 |
METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH A CONTROLLABLE CLOSING FORCE |
摘要 |
<p>The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: moving a number of mould parts (2, 3) toward each other with a closing force whereby the electronic component is enclosed by a mould cavity (5), exerting pressure on a liquid encapsulating material, filling the mould cavity (5) with encapsulating material, and curing the encapsulating material, wherein the pressure on the encapsulating material is measured, and the closing force of the mould parts and the exerted pressure are dependent on each other.</p> |
申请公布号 |
WO2010008287(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
WO2009NL50437 |
申请日期 |
2009.07.16 |
申请人 |
FICO B.V.;GAL, WILHELMUS GERARDUS JOZEF;VENROOIJ, JOHANNES LAMBERTUS GERARDUS;FIERKENS, HENRICUS ANTONIUS MARIA |
发明人 |
GAL, WILHELMUS GERARDUS JOZEF;VENROOIJ, JOHANNES LAMBERTUS GERARDUS;FIERKENS, HENRICUS ANTONIUS MARIA |
分类号 |
B29C45/02;B29C45/14;B29C45/76;H01L21/56 |
主分类号 |
B29C45/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|