发明名称 CHIP-TYPE ELECTRONIC PART HOUSING MOUNT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a housing mount with a function of efficiently fixing hydrogen sulfide generated from a mount raw material or a manufacturing process, and restraining a chip-type electronic part stored in a chip-type electronic part housing mount from rusting. SOLUTION: A method for manufacturing the chip-type electronic part housing mount is configured in such a manner that: the chip-type electronic part housing mount contains a metal chloride of copper or zinc therein preferably by 10 ppm-1,000 ppm; the metal chloride of the copper or the zinc is added to raw material pulp slurry in a range of 0.01-1.0% per pulp solid content; the metal chloride is selected from either of a copper compound such as a copper sulfate, a copper nitrate, a copper acetate, a cuprous chloride and a cupric chloride, or a zinc compound such as a zinc sulfate, a zinc chloride or the like; and particularly, the copper sulfate is selected and added in manufacturing the chip-type electronic part housing mount. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010013183(A) 申请公布日期 2010.01.21
申请号 JP20080329827 申请日期 2008.12.25
申请人 OJI PAPER CO LTD;OJI TOKUSHUSHI KK 发明人 SUENAGA HIROSHI;AMINO TOGO
分类号 B65D85/86;B65D65/40;B65D73/02;D21H17/63;D21H21/14;D21H27/10 主分类号 B65D85/86
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