| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that reduces a stress in a package process and suppresses a change of characteristics before and after the package process. <P>SOLUTION: For elements constituting a semiconductor device 100, a buffer region 8 for reducing a stress surrounds an element region 3 in which accuracy is particularly required and a stress is not to be applied from a package. Thus it is possible to suppress the influence of a tensile stress or a compressive stress in the package process, thereby reducing a change of characteristics before and after the package process. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
