AQUEOUS DISPERSING ELEMENT FOR CHEMICAL MECHANICAL POLISHING, MANUFACTURING METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an aqueous dispersing element for chemical mechanical polishing having high polishing speed and high polishing selectivity to a copper film without causing any defects to the copper film and a low-dielectric-constant insulation film even under normal pressure conditions, and having a small amount of metal contamination in a wafer, and to provide a chemical mechanical polishing method using the aqueous dispersing element for chemical mechanical polishing.

SOLUTION: The aqueous dispersing element for chemical mechanical polishing polishes the copper film. The copper film contains: a silica particle A; an organic acid B; and a water-soluble polymer C having properties as a Lewis base of which weight-average molecular weight is not less than ten thousand and not more than a million and a half. The silica particle A has the following chemical properties of a silanol group calculated from signal area of a29Si-NMR spectrum being 2.0-3.0×1021/g.

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