| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency package capable of preventing degradation of a high-frequency characteristic due to a stub structure, while fully securing the brazing strength of a lead terminal of a high-frequency package. Ž<P>SOLUTION: This high-frequency package 10 includes: a base board 11 for mounting an electronic component 12, having a pair of terminals transmitting high-frequency differential signals thereon; a pair of pads 14, connected electrically to the pair of terminals of the electronic components 12 and formed at the front surface end of the base board 11; and a pair of lead terminals 15 respectively having base ends jointed to the pair of pads 14 through brazing, and externally connected tip parts. Each of the pair of lead terminals 15 has a shape which is bent upward, with respect to the pad 14 from the base end toward the tip part, has a brazing material storage 16 of a predetermined height formed in a region on a side facing the pad 14, and can balance the high-frequency characteristics with the brazing strength with such a structure. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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