发明名称 METHOD OF ELECTROLESS PLATING
摘要 An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.
申请公布号 US2010015362(A1) 申请公布日期 2010.01.21
申请号 US20090505560 申请日期 2009.07.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JOO-HAN;LEE DONG-CHUN;KIM YONG-HYUN;HAN SEONG-CHAN
分类号 B05D1/18 主分类号 B05D1/18
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