ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER

摘要

The present invention relates to an adhesive composition containing a polymer of a monomer mixture comprising an isobornyl (meta)acrylate, an adhesive sheet, and a back grinding method for a semiconductor wafer. The present invention employs an isobornyl (meta)acrylate which is a hard-type monomer and has a low hydrophilicity, thus providing an adhesive composition with excellent water resistance, peeling properties, re-peelability and wettability to a wafer, as well as an adhesive sheet manufactured by using the composition and a back grinding method using the same.