| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: a high reliability semiconductor device and a method of manufacturing the same; a circuit board; and an electronic apparatus. <P>SOLUTION: An electrode 114 is connected to an integrated circuit. A resin layer 118 is formed on a surface where the electrode 114 of a semiconductor substrate 110 is formed so as to avoid the electrode 114. Wiring 122 is electrically connected to the electrode 114, and has a first part 150 and a second part 152 in which the first part is formed on a boundary between the side surface 121 and the upper surface 120 of the resin layer 118, and the second part is connected to the first part 150 and is formed on the upper surface 120 of the resin layer 118. The first part 150 is formed so as to have a width larger than that of the second part 152. An external terminal is electrically connected to the wiring 122. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
