发明名称 |
COPPER POWDER FOR ELECTROCONDUCTIVE PASTE, AND ELECTROCONDUCTIVE PASTE |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper powder which does not impair both of oxidation resistance and a balance of electroconductivity though the particle size is very small; a copper powder for an electroconductive paste, of which the shape and the particle size is also small and which contains little oxygen; and the electroconductive paste. SOLUTION: The copper powder for the electroconductive paste contains 0.1 to 10 atm% Si (silicon) inside the particle. The copper powder contains 0.01 to 0.3 atm% P (phosphorus) inside the particle. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010013726(A) |
申请公布日期 |
2010.01.21 |
申请号 |
JP20080330319 |
申请日期 |
2008.12.25 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
ODA AKIHIRO;KURIMOTO TOORU;UWAZUMI YOSHIAKI;MIYAKE KOICHI;YOSHIMARU KATSUHIKO |
分类号 |
C22C9/10;B22F1/00;B22F9/08;C22C9/00;H01B1/00;H01B1/22;H01B5/00 |
主分类号 |
C22C9/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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