发明名称 COPPER POWDER FOR ELECTROCONDUCTIVE PASTE, AND ELECTROCONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a copper powder which does not impair both of oxidation resistance and a balance of electroconductivity though the particle size is very small; a copper powder for an electroconductive paste, of which the shape and the particle size is also small and which contains little oxygen; and the electroconductive paste. SOLUTION: The copper powder for the electroconductive paste contains 0.1 to 10 atm% Si (silicon) inside the particle. The copper powder contains 0.01 to 0.3 atm% P (phosphorus) inside the particle. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010013726(A) 申请公布日期 2010.01.21
申请号 JP20080330319 申请日期 2008.12.25
申请人 MITSUI MINING & SMELTING CO LTD 发明人 ODA AKIHIRO;KURIMOTO TOORU;UWAZUMI YOSHIAKI;MIYAKE KOICHI;YOSHIMARU KATSUHIKO
分类号 C22C9/10;B22F1/00;B22F9/08;C22C9/00;H01B1/00;H01B1/22;H01B5/00 主分类号 C22C9/10
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