MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT

摘要

PURPOSE: A method for manufacturing an electronic component embedded printed circuit board is provided to embed an electronic component with a fine pitch by improving integration of a connection part between a substrate circuit and an electronic device. CONSTITUTION: An electronic device with an electrode formed on an upper side is received on an upper side of a bonding sheet(S110). An insulator with a cavity corresponding to the electronic component is received on the upper side of the bonding sheet(S120). A first insulation resin is stacked on the upper side of an insulator to cover the upper side of the electronic device(S130). A second insulation resin is stacked on a lower side of the bonding sheet(S140). A via hole passing through the insulator is formed using a drill(S150). An electrode is exposed by grinding the first insulation resin(S160). A first circuit pattern electrically connected to the electrode exposed to the ground first insulation resin is formed(S170). A second circuit pattern is formed on the second insulation resin(S180).