发明名称 |
PRINT PROCESSING FOR PATTERNED CONDUCTOR, SEMICONDUCTOR AND DIELECTRIC MATERIALS |
摘要 |
<p>Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.</p> |
申请公布号 |
EP2145350(A2) |
申请公布日期 |
2010.01.20 |
申请号 |
EP20080755038 |
申请日期 |
2008.05.03 |
申请人 |
KOVIO, INC. |
发明人 |
SCHER, ERIK;KAMATH, ARVIND;ROCKENBERGER, JOERG;MORI, IKUO;MOLESA, STEVEN |
分类号 |
H01L21/00;C09D11/00;C09D11/10;H01L21/02;H01L21/20;H01L21/28;H01L21/84 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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