发明名称 |
Method for Fabricating Printed Circuit Board |
摘要 |
<p>A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.</p> |
申请公布号 |
EP2146560(A1) |
申请公布日期 |
2010.01.20 |
申请号 |
EP20090163914 |
申请日期 |
2009.06.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, KI-HYUN;PARK, SE-HO;KANG, SEOK-MYONG;LEE, YOUNG-MIN |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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