| 摘要 |
PURPOSE: A stack semiconductor package is provided to select one of stacked semiconductor chips by applying a chip selection signal to each semiconductor chip. CONSTITUTION: A stack semiconductor package comprises a body(130) including a bottom(110) and a projection(120) formed from the bottom, a first chip selection electrode(140) which passes through the bottom, a second chip selection electrode(150) which passes through the projection, a container(100) with data electrodes passing through the bottom, a first semiconductor chip(210) which is arranged on the bottom and includes a first chip selection pad electrically connected to the first chip selection electrode and a first data pad connected to the data electrode, and a second semiconductor chip(220) which is arranged on the first semiconductor chip and includes a second chip selection pad electrically connected to the second chip selection electrode and a second data pad connected to the data electrode.
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