| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling tape to peel off an adhesive sheet stuck to an adherend without adhesion by holding a holding part. SOLUTION: The peeling tape PT is used for peeling off the adhesive sheet S from a semiconductor wafer W by sticking it to the surface of the adhesive sheet S for protection stuck to the semiconductor wafer W. The peeling tape PT is constructed by disposing an adhesive layer A on one surface of a substrate sheet BS, and folding a portion of the substrate sheet BS so as to form the holding part 11 with no adhesive layer A exposed thereon, and on the other hand so as to make a portion with the adhesive layer A exposed thereon be the adhesive part 10. When the adhesive sheet S is to be peeled off from the semiconductor wafer W, the adhesive part 10 is stuck to the adhesive sheet S, and the adhesive sheet S is peeled off therefrom by holding the holding part 11 and pulling the peeling tape PT. COPYRIGHT: (C)2010,JPO&INPIT |
