| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing device and its method for selectively etching a substrate surface. SOLUTION: In the substrate processing method, a first nozzle supplies an etchant to the center of a rotating substrate, and a second nozzle supplies an etching disturbing fluid, diluting the concentration of the etchant, at a position apart from the center of the substrate. COPYRIGHT: (C)2010,JPO&INPIT
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