| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring substrate, which can respond to miniaturization (line:space = 15:15μm or less) of a wiring layer, and also can obtain sufficient adhesion between the wiring layer and an underlying insulating layer. SOLUTION: The method of manufacturing the wiring substrate includes a step of forming a first wiring layer 20 on the underlying layer 10, a step of forming a laminate in which a protective layer 36 is provided on an insulating layer 30, on the first wiring layer 20, a step of forming a via hole VH reaching the first wiring layer 20 by processing the protective layer 36 and the insulating layer 30, a step of roughening a side surface of the via hole VH by applying a desmear process to an inside of the via hole VH while using the protective layer 36 as a mask, a step of removing the protective layer 36, and a step of forming a second wiring layer 40, which is connected to the first wiring layer 20 via the via hole VH, on the insulating layer 30. The second wiring layer 40 may be formed after the surface of the insulating layer 30 is roughened, or the second wiring layer 40 may be formed without roughening the surface of the insulating layer 30. COPYRIGHT: (C)2010,JPO&INPIT |
