| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a COF (chip on film) substrate having a wiring pattern capable of preventing crack and disconnection of a bent portion caused in bending the substrate. Ž<P>SOLUTION: The COF substrate includes a plurality of wirings each having a wide wiring portion 2w having a first bent portion 2a, a narrow wiring portion 2n and a coupling portion having a second bent portion 2b for connecting both the wiring portions. The COF substrate has one or more wirings formed so that any one of opposite side edges of the wirings 2, 3 adjacent to each other may match a line segment connecting a corner of the first bending portion 2a of one wiring 2, the line segment being a tangent line of a circle having a radius of a distance between narrow wiring portions 2n, 3n centered at a corner of the second bending portion 3b of the other wiring 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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